Episode 155: Ultra HDI Panel Discussion - Recorded Live at SMTAI

Reliability Matters

Today, I’m in Rosemont Illinois at SMTAI, Surface Mount Technology International. I’m in the Ultra-HDI Pavilion on the trade show floor. And what are we going to talk about here in the Ultra-HDI pavilion? Ultra high density interconnects, of course.
As the demand for smaller, faster, and more powerful devices grows, the need for innovative solutions in circuit design has never been greater. UHDI's represent a significant leap forward, allowing for more connections in a smaller space, pushing the boundaries of what's possible in electronic assemblies.
But what exactly are UHDI's? Essentially, they refer to circuit boards with incredibly fine pitch interconnects, enabling higher functionality and complexity in much smaller form factors.
This breakthrough is transforming industries like consumer electronics, aerospace, automotive, and medical devices, where space, weight, and performance are critical factors.
In this episode, we’ll explore the advantages UHDI's bring to the table, from increased design flexibility and performance to better thermal management. We'll also discuss how UHDI's are set to impact the assembly process. With tighter tolerances and more intricate layouts, UHDI assemblies will require new approaches to assembly, inspection, and reliability testing.
To better explain UHDI technology, we’ve put together a panel of subject matter experts. Tara Dunn, Director of Training and Education at the Surface Mount Technology Association (SMTA), will moderate a panel discussion with other subject matter experts.
In addition to Tara, our other experts are Anaya Vardya CEO of American Standard Circuits, Chrys Shea from Shea Engineering Services, Michael Sivigny, owner and General Manager of CeTaQ Americas, and Oren Manor, Op-Center Core Program Business Director at Siemens Digital Industries Software.
Ultra-HDI is here! And if you haven’t seen it on your assembly line yet, it’s coming, so stay tuned as we unpack the future of Ultra High Density Interconnects and what it means for the next generation of technology.